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1

Assembly and packaging of a three-axis micro accelerometer used for detection of heart infarction

Kristin Imenes, Knut Aasmundtveit, Ellen Marie Husa, Jan Olav Høgetveit, Steinar Halvorsen, Ole Jakob Elle, Peyman Mirtaheri, Erik Fosse, Lars Hoff

Journal:

Biomedical Microdevices

Year:

2007

Language:

english

File:

PDF, 227 KB

english, 2007

2

Influence of Glass-Frit Material Distribution on the Performance of Precision Piezoresistive MEMS Pressure Sensors

Sandvand, Asmund, Halvorsen, Einar, Aasmundtveit, Knut E., Jakobsen, Henrik

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2015

Language:

english

File:

PDF, 2.72 MB

english, 2015

3

Structure of thin films of poly(3,4-ethylenedioxythiophene)

K.E. Aasmundtveit, E.J. Samuelsen, L.A.A. Pettersson, O. Inganäs, T. Johansson, R. Feidenhans'l

Journal:

Synthetic Metals

Year:

1999

Language:

english

File:

PDF, 470 KB

english, 1999

4

Wafer-Level Cu/Sn to Cu/Sn SLID-Bonded Interconnects With Increased Strength

He Liu, Salomonsen, G., Kaiying Wang, Aasmundtveit, K.E., Hoivik, N.

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2011

Language:

english

File:

PDF, 1.27 MB

english, 2011

5

Miniaturization of package for an implantable heart monitoring device

Nguyen, Anh-Tuan T., Tjulkins, Fjodors, Aasmundtveit, K. E., Hoivik, Nils, Hoff, Lars, Imenes, Kristin

Journal:

Microsystem Technologies

Year:

2015

Language:

english

File:

PDF, 2.41 MB

english, 2015

6

High Temperature Interconnect and Die Attach Technology: Au–Sn SLID Bonding

Tollefsen, Torleif Andre, Larsson, Andreas, Lovvik, Ole Martin, Aasmundtveit, Knut E.

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2013

Language:

english

File:

PDF, 1.27 MB

english, 2013

7

[IEEE 2012 4th Electronic System-Integration Technology Conference (ESTC) - Amsterdam, Netherlands (2012.09.17-2012.09.20)] 2012 4th Electronic System-Integration Technology Conference - Implantable MEMS acceleration sensor for heart monitoring recent development and outlook

Imenes, Kristin, Andersen, Mona Helene, Nguyen, Anh-Tuan Thai, Tjulkins, Fjodors, Aasmundtveit, Knut E., Hoivik, Nils, Hoff, Lars

Year:

2012

Language:

english

File:

PDF, 9.03 MB

english, 2012

8

Die Shear Testing of a Novel Isotropic Conductive Adhesive—Epoxy Filled With Metal-Coated Polymer Spheres

Nguyen, Hoang-Vu, Andreassen, Erik, Kristiansen, Helge, Aasmundtveit, Knut E.

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2013

Language:

english

File:

PDF, 1.75 MB

english, 2013

9

Electrical characterization of individual metal-coated polymer spheres used in isotropic conductive adhesives

Nguyen, Hoang-Vu, He, Jianying, Helland, Tore, Kristiansen, Helge, Aasmundtveit, Knut E.

Journal:

Journal of Applied Polymer Science

Year:

2016

Language:

english

File:

PDF, 1.44 MB

english, 2016

10

Identification and Elimination of Hygro-Thermo- Mechanical Stress-Effects in a High-Precision MEMS Pressure Sensor

Sandvand, Asmund, Halvorsen, Einar, Aasmundtveit, Knut E., Jakobsen, Henrik

Journal:

Journal of Microelectromechanical Systems

Year:

2017

Language:

english

File:

PDF, 2.52 MB

english, 2017

11

[IEEE 2016 6th Electronic System-Integration Technology Conference (ESTC) - Grenoble, France (2016.9.13-2016.9.15)] 2016 6th Electronic System-Integration Technology Conference (ESTC) - Investigation of contacts between metal and transparent conductive oxides

Nghiem, Giang M., Kristiansen, Helge, Aasmundtveit, Knut

Year:

2016

Language:

english

File:

PDF, 7.59 MB

english, 2016

12

[IEEE 2017 IEEE 17th International Conference on Nanotechnology (IEEE-NANO) - Pittsburgh, PA, USA (2017.7.25-2017.7.28)] 2017 IEEE 17th International Conference on Nanotechnology (IEEE-NANO) - Design considerations of CMOS micro-heaters to directly synthesize carbon nanotubes for gas sensing applications

Roy, Avisek, Ender, Perene, Azadmehr, Mehdi, Ta, Bao Q., Aasmundtveit, Knut E.

Year:

2017

Language:

english

File:

PDF, 613 KB

english, 2017

13

Stability of Laser-Patterned Electrode Compositions

Holhjem, Lars, Strand-Amundsen, Runar, Aasmundtveit, Knut E., Tonnessen, Tor I.

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2018

Language:

english

File:

PDF, 6.32 MB

english, 2018

14

Shear strength of off-eutectic Au Ge joints at high-temperature

Larsson, Andreas, Tollefsen, Torleif A., Aasmundtveit, Knut E.

Journal:

Microelectronics Reliability

Year:

2019

Language:

english

File:

PDF, 26.70 MB

english, 2019

15

Shear strength of off-eutectic Au Ge joints at high-temperature

Larsson, Andreas, Tollefsen, Torleif A., Aasmundtveit, Knut E.

Journal:

Microelectronics Reliability

Year:

2019

File:

PDF, 26.70 MB

2019

16

Au-Sn SLID Bonding—Properties and Possibilities

Torleif A. Tollefsen, Andreas Larsson, Ole Martin Løvvik, Knut Aasmundtveit

Journal:

Metallurgical and Materials Transactions B

Year:

2012

Language:

english

File:

PDF, 557 KB

english, 2012

17

Structural Anisotropy of Poly(alkylthiophene) Films

Aasmundtveit, K. E., Samuelsen, E. J., Guldstein, M., Steinsland, C., Flornes, O., Fagermo, C., Seeberg, T. M., Pettersson, L. A. A., Inganäs, O., Feidenhans'l, R.

Journal:

Year:

2000

Language:

english

File:

PDF, 140 KB

english, 2000

18

Oxygen-induced ESR line broadening in conducting polymers

K. Aasmundtveit, F. Genoud, E. Houzé, M. Nechtschein

Journal:

Synthetic Metals

Year:

1995

Language:

english

File:

PDF, 411 KB

english, 1995

19

Structural aspects of electrochemical doping and dedoping of poly(3,4-ethylenedioxythiophene)

K.E Aasmundtveit, E.J Samuelsen, O Inganäs, L.A.A Pettersson, T Johansson, S Ferrer

Journal:

Synthetic Metals

Year:

2000

Language:

english

File:

PDF, 221 KB

english, 2000

20

Erratum to “Thermochromic distortions in a poly(3-alkylthiophene): an atomistic simulation investigation”: [Synthetic Metals 113 (2000) 65–72]

Hongwei Xie, J Corish, D.A Morton-Blake, K.E Aasmundtveit

Journal:

Synthetic Metals

Year:

2001

File:

PDF, 41 KB

2001

21

The structure of polypyridine

E.J. Samuelsen, A.P. Monkman, L.A.A. Pettersson, L.E. Horsburgh, K.E. Aasmundtveit, S. Ferrer

Journal:

Synthetic Metals

Year:

2001

Language:

english

File:

PDF, 177 KB

english, 2001

22

Role of sidechain sequence in stereoregular polyalkylterthiophene

Ove R Konestabo, K.E. Aasmundtveit, E.J. Samuelsen, E. Bakken, P.H.J. Carlsen

Journal:

Synthetic Metals

Year:

1997

Language:

english

File:

PDF, 196 KB

english, 1997

23

Orientation effect in thin layers of poly(octylthiophene) on glass studied by synchrotron X-ray diffraction

K.E. Aasmundtveit, E.J. Samuelsen, J. Mrdalen, E. Bakken, P.H.J. Carlsen, U. Lienert

Journal:

Synthetic Metals

Year:

1997

Language:

english

File:

PDF, 537 KB

english, 1997

24

EXAFS studies of iodine-doped poly(octylthiophene)

K.E. Aasmundtveit, E.J. Samuelsen, C. Steinsland, C. Meneghini, A. Filipponi

Journal:

Synthetic Metals

Year:

1999

Language:

english

File:

PDF, 243 KB

english, 1999

25

Lattice simulations of thermochromic distortions in poly(alkylthiophene)s

Hongwei Xie, J. Corish, S.G. Ali, D.A. Morton-Blake, K. Aasmundtveit

Journal:

Synthetic Metals

Year:

1999

Language:

english

File:

PDF, 223 KB

english, 1999

26

Structural studies of polyalkylthiophenes with alternating sidechain positioning

K.E Aasmundtveit, E.J Samuelsen, K Hoffmann, E Bakken, P.H.J Carlsen

Journal:

Synthetic Metals

Year:

2000

Language:

english

File:

PDF, 480 KB

english, 2000

27

Intermetallic Compound Formation Mechanisms for Cu-Sn Solid–Liquid Interdiffusion Bonding

H. Liu, K. Wang, K.E. Aasmundtveit, N. Hoivik

Journal:

Journal of Electronic Materials

Year:

2012

Language:

english

File:

PDF, 914 KB

english, 2012

28

Local synthesis of carbon nanotubes for direct integration in Si microsystems – design considerations

Aasmundtveit, Knut E., Ta, Bao Quoc, Nguyen, Quoc-Huy, Haugen, Tormod B., Hoivik, Nils, Halvorsen, Einar

Journal:

Advances in Manufacturing

Year:

2013

Language:

english

File:

PDF, 695 KB

english, 2013

29

[IEEE 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2013.05.28-2013.05.31)] 2013 IEEE 63rd Electronic Components and Technology Conference - Cu/Sn SLID wafer-level bonding optimization

Luu, Thi-Thuy, Duan, Ani, Wang, Kaiying, Aasmundtveit, Knut, Hoivik, Nils

Year:

2013

Language:

english

File:

PDF, 1.02 MB

english, 2013

30

[IEEE 2012 4th Electronic System-Integration Technology Conference (ESTC) - Amsterdam, Netherlands (2012.09.17-2012.09.20)] 2012 4th Electronic System-Integration Technology Conference - Reducing the bond frame width in Cu/Sn SLID wafer level packaging

Duan, Ani, Wang, Kaiying, Aasmundtveit, Knut E., Hoivik, Nils

Year:

2012

Language:

english

File:

PDF, 4.10 MB

english, 2012

31

Rheological characterization of a novel isotropic conductive adhesive – Epoxy filled with metal-coated polymer spheres

Nguyen, Hoang-Vu, Andreassen, Erik, Kristiansen, Helge, Johannessen, Rolf, Hoivik, Nils, Aasmundtveit, Knut E.

Journal:

Materials & Design

Year:

2013

Language:

english

File:

PDF, 875 KB

english, 2013

32

Diameter dependency for the electric-field-assisted growth of carbon nanotubes

Ta, Bao Q., Halvorsen, Einar, Hoivik, Nils, Aasmundtveit, Knut E.

Journal:

Applied Physics Letters

Year:

2013

Language:

english

File:

PDF, 1.38 MB

english, 2013

33

Optimized Cu-Sn Wafer-Level Bonding Using Intermetallic Phase Characterization

Thi-Thuy Luu,Ani Duan,Knut E. Aasmundtveit…

Journal:

Journal of Electronic Materials

Year:

2013

Language:

english

File:

PDF, 760 KB

english, 2013

34

Structural Ordering in Phenyl-Substituted Polythiophenes

Aasmundtveit, K. E., Samuelsen, E. J., Mammo, W., Svensson, M., Andersson, M. R., Pettersson, L. A. A., Inganäs, O.

Journal:

Year:

2000

Language:

english

File:

PDF, 174 KB

english, 2000

35

[IEEE 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2013.05.28-2013.05.31)] 2013 IEEE 63rd Electronic Components and Technology Conference - 3-Axis MEMS accelerometer-based implantable heart monitoring system with novel fixation method

Tjulkins, Fjodors, Nguyen, Anh Tuan Thai, Hoivik, Nils, Aasmundtveit, Knut E., Andreassen, Erik, Hoff, Lars, Imenes, Kristin

Year:

2013

Language:

english

File:

PDF, 703 KB

english, 2013

36

[IEEE 2012 IEEE 12th International Conference on Nanotechnology (IEEE-NANO) - Birmingham, United Kingdom (2012.08.20-2012.08.23)] 2012 12th IEEE International Conference on Nanotechnology (IEEE-NANO) - Observations on defects and contact modes for locally grown CNTs

Ta, Bao Quoc, Huy Quoc Nguyen,, Hoivik, Nils, Halvorsen, Einar, Aasmundtveit, Knut E.

Year:

2012

Language:

english

File:

PDF, 1.83 MB

english, 2012

37

[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China (2011.08.8-2011.08.11)] 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging - Ultra-low leak detection of Cu-Sn SLID for high density wafer level packaging

Duan, Ani, Aasmundtveit, Knut, Hoivik, Nils

Year:

2011

Language:

english

File:

PDF, 2.07 MB

english, 2011

38

[IEEE International Conference on Science and Technology of Synthetic Metals - Seoul, Korea (1994.07.24-1994.07.29)] International Conference on Science and Technology of Synthetic Metals - ESR in conducting polymers: effect of oxygen and air

Aasmundtveit, K., Genoud, F., Nechtschein, M.

Year:

1994

Language:

english

File:

PDF, 65 KB

english, 1994

39

[IEEE 2012 4th Electronic System-Integration Technology Conference (ESTC) - Amsterdam, Netherlands (2012.09.17-2012.09.20)] 2012 4th Electronic System-Integration Technology Conference - Optimization of Cu/Sn wafer-level bonding based upon intermetallic characterization

Luu, Thi-Thuy, Duan, Ani, Wang, Kaiying, Aasmundtveit, Knut E., Hoivik, Nils

Year:

2012

Language:

english

File:

PDF, 2.56 MB

english, 2012

40

[IEEE 2012 4th Electronic System-Integration Technology Conference (ESTC) - Amsterdam, Netherlands (2012.09.17-2012.09.20)] 2012 4th Electronic System-Integration Technology Conference - Low temperature bonding of piezoelectric single crystal materials for miniaturized high resolution ultrasound transducers

Ng, Jack Hoy-Gig, Ssekitoleko, Robert T., Nguyen, Hoang-Vu, Aasmundtveit, Knut E., Demore, Christine E. M., Cochran, Sandy, Desmulliez, Marc P.Y.

Year:

2012

Language:

english

File:

PDF, 5.19 MB

english, 2012

41

[IEEE 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2010.06.1-2010.06.4)] 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Intermetallic Cu3Sn as oxidation barrier for fluxless Cu-Sn bonding

Liu, H., Wang, K., Aasmundtveit, K., Hoivik, N.

Year:

2010

Language:

english

File:

PDF, 762 KB

english, 2010

42

[IEEE 2012 4th Electronic System-Integration Technology Conference (ESTC) - Amsterdam, Netherlands (2012.09.17-2012.09.20)] 2012 4th Electronic System-Integration Technology Conference - Thermosonic bonding for ultrasound transducers: Low-temperature metallurgical bonding

Aasmundtveit, Knut E., Luu, Thi Thuy, Eggen, Trym, Baumgartner, Charles E, Hoivik, Nils, Wang, Kaiying, Nguyen, Hoang-Vu, Imenes, Kristin

Year:

2012

Language:

english

File:

PDF, 688 KB

english, 2012

43

[IEEE 2012 4th Electronic System-Integration Technology Conference (ESTC) - Amsterdam, Netherlands (2012.09.17-2012.09.20)] 2012 4th Electronic System-Integration Technology Conference - Anisotropic conductive film interconnects for fine-pitch MEMS

Nguyen, Hoang-Vu, Kristiansen, Helge, Larsson, Andreas, Poppe, Erik, Johannessen, Rolf, Hoivik, Nils, Aasmundtveit, Knut E.

Year:

2012

Language:

english

File:

PDF, 1.64 MB

english, 2012

44

[IEEE 2012 14th International Conference on Electronic Materials and Packaging (EMAP) - Lantau Island, Hong Kong (2012.12.13-2012.12.16)] 2012 14th International Conference on Electronic Materials and Packaging (EMAP) - Low temperature bonding of piezoelectric single crystal materials for miniaturized high resolution ultrasound transducers

Ng, Jack Hoy-Gig, Ssekitoleko, Robert T., Hoang-Vu Nguyen,, Aasmundtveit, Knut E., Demore, Christine E. M., Cochran, Sandy, Desmulliez, Marc P.Y.

Year:

2012

Language:

english

File:

PDF, 756 KB

english, 2012

45

[IEEE 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2014.5.27-2014.5.30)] 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Assembly of multiple chips on flexible substrate using anisotropie conductive film for medical imaging applications

Nguyen, Hoang-Vu, Eggen, Trym, Sten-Nilsen, Bjornar, Imenes, Kristin, Aasmundtveit, Knut E.

Year:

2014

Language:

english

File:

PDF, 406 KB

english, 2014

46

[IEEE 2012 4th Electronic System-Integration Technology Conference (ESTC) - Amsterdam, Netherlands (2012.09.17-2012.09.20)] 2012 4th Electronic System-Integration Technology Conference - Isotropic conductive adhesive filled with metal-coated polymer spheres — Effects of metal coating on rheological and mechanical properties

Nguyen, Hoang-Vu, Kristiansen, Helge, Johannessen, Rolf, Andreassen, Erik, Hoivik, Nils, Aasmundtveit, Knut E.

Year:

2012

Language:

english

File:

PDF, 1.65 MB

english, 2012

47

[IEEE 2010 3rd Electronic System-Integration Technology Conference (ESTC) - Berlin, Germany (2010.09.13-2010.09.16)] 3rd Electronics System Integration Technology Conference ESTC - Spherical polymer particles in isotropic conductive adhesives a study on rheology and mechanical aspects

Nguyen, Hoang-Vu, Kristiansen, Helge, Gakkestad, Jakob, Johannessen, Rolf, Hoivik, Nils, Aasmundtveit, Knut E

Year:

2010

Language:

english

File:

PDF, 1.39 MB

english, 2010

48

[IEEE 2008 2nd Electronics Systemintegration Technology Conference - Greenwich (2008.09.1-2008.09.4)] 2008 2nd Electronics Systemintegration Technology Conference - Micro ribbon cable bonding for an implantable device

Imenes, K., Aasmundtveit, K., Bjornsen, G., Moreno, P., de Aldana, J.R.V.

Year:

2008

Language:

english

File:

PDF, 7.77 MB

english, 2008

49

[IEEE 2012 4th Electronic System-Integration Technology Conference (ESTC) - Amsterdam, Netherlands (2012.09.17-2012.09.20)] 2012 4th Electronic System-Integration Technology Conference - Reliable HT electronic packaging — Optimization of a Au-Sn SLID joint

Tollefsen, Torleif A., Taklo, Maaike M. Visser, Aasmundtveit, Knut E., Larsson, Andreas

Year:

2012

Language:

english

File:

PDF, 1.33 MB

english, 2012

50

[IEEE 2010 3rd Electronic System-Integration Technology Conference (ESTC) - Berlin, Germany (2010.09.13-2010.09.16)] 3rd Electronics System Integration Technology Conference ESTC - Au-Sn fluxless SLID bonding: Effect of bonding temperature for stability at high temperature, above 400 °C

Aasmundtveit, Knut E., Thuy Luu, Thi, Nguyen, Hoang-Vu, Johannessen, Rolf, Hoivik, Nils, Wang, Kaiying

Year:

2010

Language:

english

File:

PDF, 954 KB

english, 2010

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